High doped III-V source/drain junctions for field effect transistors

ABSTRACT

A semiconductor device includes a fin patterned in a substrate; a gate disposed over and substantially perpendicular to the fin; a pair of epitaxial contacts including a III-V material over the fin and on opposing sides of the gate; and a channel region between the pair of epitaxial contacts under the gate comprising an undoped III-V material between doped III-V materials, the doped III-V materials including a dopant in an amount in a range from about 1e18 to about 1e20 atoms/cm3 and contacting the epitaxial contacts.

DOMESTIC PRIORITY

This application is a divisional of and claims priority from U.S. patentapplication Ser. No. 14/812,425, filed on Jul. 29, 2015, entitled “HIGHDOPED III-V SOURCE/DRAIN JUNCTIONS FOR FIELD EFFECT TRANSISTORS”, theentire contents of which are incorporated herein by reference.

BACKGROUND

The present invention generally relates to semiconductor devices, andmore specifically, to source-drain contacts in semiconductor devices.

Challenges facing silicon (Si) complementary metal-oxide semiconductor(CMOS) technology has led to using new materials and novel devicestructures. Semiconducting III-V compounds and materials, e.g.,indium-gallium-arsenic (InGaAs) and indium-gallium-antimony (InGaSb),are attractive channel materials in metal-oxide-semiconductorfield-effect transistors (MOSFETs) due to their low band gaps and highcarrier mobility properties.

The fin-type field effect transistor (FinFET) is a type of MOSFET. TheFinFet is a double-gate silicon-on-insulator (SOI) device that mitigatesthe effects of short channels and reduces drain-induced barrierlowering. The “fin” refers to the narrow channel between source anddrain regions. A thin insulating oxide layer on either side of the finseparates the fin from the gate.

SUMMARY

In one embodiment of the present invention, a semiconductor deviceincludes a fin patterned in a substrate; a gate disposed over andsubstantially perpendicular to the fin; a pair of epitaxial contactsincluding a III-V material over the fin and on opposing sides of thegate; and a channel region between the pair of epitaxial contacts underthe gate comprising an undoped III-V material between doped III-Vmaterials, the doped III-V materials including a dopant in an amount ina range from about 1e¹⁸ to about 1e²⁰ atoms/cm³ and contacting theepitaxial contacts.

In another embodiment, a method of making a semiconductor deviceincludes depositing a layer of a first doped III-V material onto asubstrate, the first doped III-V material including a dopant in anamount in a range from about 1e¹⁸ to about 1e²⁰ atoms/cm³; patterning afin in the first doped III-V material and the substrate; forming a gatestructure over and substantially perpendicular to the fin; growing by anepitaxial process a pair of epitaxial contacts including a second dopedIII-V material over the fin and on opposing sides of the gate structure;etching to remove the first doped III-V material from a portion of thechannel region beneath the gate structure; filling the portion ofchannel region with an undoped III-V material to form a channelincluding the undoped III-V material between remaining portions of thefirst doped III-V material; and filling the gate structure with aconductive gate metal.

Yet, in another embodiment, a method of making a semiconductor deviceincludes depositing a layer of a doped III-V material onto a substrate,the doped III-V material including a dopant in an amount in a range fromabout 1e¹⁸ to about 1e²⁰ atoms/cm³; patterning a fin in the doped III-Vmaterial and the substrate; forming a gate structure over andsubstantially perpendicular to the fin; growing by an epitaxial processa pair of epitaxial contacts including a III-V material over the fin andon opposing sides of the gate; etching to remove the doped III-Vmaterial from a portion of a channel region beneath the gate structure;building up the channel region by filling the gate structure and thechannel region with an undoped III-V material; performing a timedetching process to remove the undoped III-V material from the gatestructure and leave the undoped III-V material between remainingportions of the doped III-V material; and filling the gate structurewith a conductive gate metal.

BRIEF DESCRIPTION OF THE DRAWINGS

The subject matter which is regarded as the invention is particularlypointed out and distinctly claimed in the claims at the conclusion ofthe specification. The forgoing and other features, and advantages ofthe invention are apparent from the following detailed description takenin conjunction with the accompanying drawings in which:

FIG. 1A illustrates a top view of a semiconductor device comprising agate disposed over fins;

FIGS. 1B, 1C, and 1D illustrate cross-sectional side views through theXX′, YY′, and ZZ′ planes, respectively, of FIG. 1A and show finspatterned in a substrate;

FIGS. 2A, 2B, and 2C are cross-sectional side views through the XX′,YY′, and ZZ′ planes, respectively, after depositing an oxide layer, aremovable gate material layer, and a hard mask layer over the fins;

FIGS. 2D, 2E, and 2F are cross-sectional side views through the XX′,YY′, and ZZ′ planes, respectively, after performing a reactive ion etch(ME) process to form a replacement gate with spacers along the gatesidewalls;

FIGS. 3A, 3B, and 3C are cross-sectional side views through the XX′,YY′, and ZZ′ planes, respectively, after performing an epitaxial growthprocess to form epitaxial contacts;

FIGS. 4A, 4B, and 4C are cross-sectional side views through the XX′,YY′, and ZZ′ planes, respectively, after depositing a low-k dielectricoxide layer over the epitaxial contacts;

FIGS. 5A, 5B, and 5C are cross-sectional side views through the XX′,YY′, and ZZ′ planes, respectively, after removing the removable gatematerial;

FIGS. 5D, 5E, and 5F are cross-sectional side views through the XX′,YY′, and ZZ′ planes, respectively, after forming a fin recess to exposethe buffer layer beneath;

FIGS. 6A, 6B, and 6C are cross-sectional side views through the XX′,YY′, and ZZ′ planes, respectively, after performing a replacement fingrowth process;

FIGS. 6D, 6E, and 6F are cross-sectional side views through the XX′,YY′, and ZZ′ planes, respectively, after planarizing the replacement finmaterial;

FIGS. 7A, 7B, and 7C are cross-sectional side views through the XX′,YY′, and ZZ′ planes, respectively, after recessing the fins;

FIGS. 7D, 7E, and 7F are cross-sectional side views through the XX′,YY′, and ZZ′ planes, respectively, after removing surrounding low-kdielectric oxide to expose the final fins;

FIGS. 8A, 8B, and 8C are cross-sectional side views though the XX′, YY′,and ZZ′ planes, respectively, after filling the gate with a high-kmaterial and a metal gate material; and

FIG. 8D is a top view of the conductive metal gate disposed over thefinal fins and channel region.

DETAILED DESCRIPTION

Although FinFETs are more scalable to smaller dimensions than planarMOSFETs, aggressive scaling of fin widths can lead to high seriesresistance. A sharp and heavily doped junction between the channelregion and the source and drain regions is desirable to provide lowerresistance in the channel junction.

While a sharp and heavily doped channel junction is desired, there arehowever strict constraints on the thermal budgets in devices with III-Vchannels. In particular, ion-implantation and annealing used for formingIII-V channels may exceed the allowed temperature. Further, regrowth ofhighly doped source and drain regions may not reduce the resistanceunder the gate spacers. Such regrowth processes also may be above theallowed thermal budget on the channel.

Accordingly, embodiments of the present invention provide asemiconductor device and methods for forming devices with a sharpchannel junction that provides reduced resistance. Specifically,embodiments of the present invention provide a replacement fin channelapproach to form a sharp and heavily doped source and drain contact. Itis noted that like reference numerals refer to like elements acrossdifferent embodiments.

The following definitions and abbreviations are to be used for theinterpretation of the claims and the specification. As used herein, theterms “comprises,” “comprising,” “includes,” “including,” “has,”“having,” “contains” or “containing,” or any other variation thereof,are intended to cover a non-exclusive inclusion. For example, acomposition, a mixture, process, method, article, or apparatus thatcomprises a list of elements is not necessarily limited to only thoseelements but can include other elements not expressly listed or inherentto such composition, mixture, process, method, article, or apparatus.

As used herein, the articles “a” and “an” preceding an element orcomponent are intended to be nonrestrictive regarding the number ofinstances (i.e. occurrences) of the element or component. Therefore, “a”or “an” should be read to include one or at least one, and the singularword form of the element or component also includes the plural unlessthe number is obviously meant to be singular.

As used herein, the terms “invention” or “present invention” arenon-limiting terms and not intended to refer to any single aspect of theparticular invention but encompass all possible aspects as described inthe specification and the claims.

As used herein, the term “about” modifying the quantity of aningredient, component, or reactant of the invention employed refers tovariation in the numerical quantity that can occur, for example, throughtypical measuring and liquid handling procedures used for makingconcentrates or solutions. Furthermore, variation can occur frominadvertent error in measuring procedures, differences in themanufacture, source, or purity of the ingredients employed to make thecompositions or carry out the methods, and the like. In one aspect, theterm “about” means within 10% of the reported numerical value. Inanother aspect, the term “about” means within 5% of the reportednumerical value. Yet, in another aspect, the term “about” means within10, 9, 8, 7, 6, 5, 4, 3, 2, or 1% of the reported numerical value.

As used herein, the term “III-V material” means a material or compoundincluding at least one III element and at least one V element.

As used herein, the term “III element” means aluminum (Al), boron (B),gallium (Ga), indium (In), or any combination thereof.

As used herein, the term “V element” means nitrogen (N), phosphorous(P), arsenic (As), antimony (Sb), or any combination thereof.

Turning now to the figures, FIG. 1A is shown for orientation purposesand illustrates an initial top view of a semiconductor gate region 121to be subsequently disposed over fins 110. The fins 110 are surroundedby shallow trench isolation (STI) regions, described below.

FIGS. 1B, 1C, and 1D illustrate cross-sectional side views through theXX′, YY′, and ZZ′ planes, respectively, of FIG. 1A. FIGS. 1B, 1C, and 1Dshow the fins 110 patterned in a substrate 111. Note that FIG. 1D looksthe same as FIG. 1C upon initial fin 110 and STI region 120 formation,or in the “starting substrate.” The substrate 111 includes any suitablesubstrate material. Non-limiting examples of suitable substratematerials include p-type materials, n-type materials, neutral-typematerials, silicon, germanium, gallium silicon, germanium arsenide,silicon germanium, silicon-on-insulator (SOI), or any combinationthereof.

The thickness of the substrate 111 is not intended to be limited. In oneaspect, the thickness of the substrate 111 is in a range from about 2 toabout 5 micrometers (μm). In another aspect, the thickness of thesubstrate 111 is in a range from about 0.05 μm to about 0.10 μm.

A buffer layer 112 is disposed onto the substrate 111. The buffer layer112 includes, for example, carbon doped silicon. Other non-limitingexamples of suitable materials for the buffer layer 112 include AN,InGaAs, AlGaAs, or any combination thereof. The buffer layer 112 forms adiffusion prevention layer that prevents diffusion of the dopants inheavily doped III-V material layer 113, which is described below. Insome embodiments, the buffer layer 112 is optional. When present, thethickness of the buffer layer 112 is in a range from about 100 to about150 nm. In another aspect, the thickness of the buffer layer 112 is in arange from about 30 to about 50 nm. Yet, in another aspect, thethickness of the buffer layer 112 is about or in any range from about30, 40, 50, 60, 70, 80, 90, 100, 110, 120, 130, 140, and 150 nm.

A heavily doped III-V material layer 113 is formed over the buffer layer112, which forms the topmost surface of the fin 110. The heavily dopedIII-V material layer 113 includes a III-V material. Non-limitingexamples of suitable III-V compounds include GaAs, InGaAs, AlGaInP, orany combination thereof.

The III-V material is heavily doped with an n-type dopant (e.g., GroupIV or VI elements) or a p-type dopant (e.g., Group II or IV elements),depending on the type of transistor. Doping is performed by an in-situdoping process (not implantation). The III-V material is doped to adopant concentration in a range from about 1e¹⁸ to about 1e¹⁹ atoms/cm³.In one aspect, the III-V material is doped to a dopant concentration ina range from about 1e¹⁸ to about 1e²⁰ atoms/cm³.

To form the fins 110, lithography and etching are performed. Lithographycan include forming a photoresist (not shown) on the heavily doped III-Vmaterial layer 113, exposing the photoresist to a desired pattern ofradiation, and then developing the exposed photoresist with a resistdeveloper to provide a patterned photoresist on top of the heavily dopedIII-V material layer 113. At least one etch is the employed to transferthe pattern from the patterned photoresist through the heavily dopedIII-V material layer 113, through the buffer layer 112, and partiallyinto the substrate 111. The etching process may be a dry etch (e.g.,reactive ion etching, plasma etching, ion beam etching, or laserablation). The etching process may be a wet chemical etch (e.g.,potassium hydroxide (KOH)). Both dry etching and wet chemical etchingprocesses may be used. After transferring the pattern, the patternedphotoresist is removed utilizing resist stripping processes, forexample, ashing.

A shallow trench isolation (STI) process is performed to form the STIregions. The STI regions 120 are formed by depositing an oxide over thefins 110 and polishing to the top of the heavily doped III-V materiallayer 113.

FIGS. 2A, 2B, and 2C are cross-sectional side views through the XX′,YY′, and ZZ′ planes, respectively, after depositing an oxide layer 210,a removable gate material layer 212 (e.g., polysilicon/amorphoussilicon), and a hard mask layer 214 over the fins 110. The oxide layer210 and the removable gate material layer 212 will form dummy gates 240over the fins 110, as shown in FIG. 3A described below.

A non-limiting example of a suitable material for the oxide layer 210 issilicon oxide. The thickness of the oxide layer 210 is not intended tobe limited. In one aspect, the thickness of the oxide layer 210 is in arange from about 10 to about 20 nm. In another aspect, the thickness ofthe oxide layer 210 is about or in any range from about 10, 12, 14, 16,18, and 20 nm.

Non-limiting examples of suitable materials for the hard mask layer 214include SiN, SiOCN, SiBCN, or any combination thereof. The thickness ofthe hard mask layer 214 is not intended to be limited. In one aspect,the thickness of the hard mask layer 214 is in a range from about 30 toabout 50 nm. In another aspect, the thickness of the hard mask layer 214is in a range from about 35 to about 45 nm.

FIGS. 2D, 2E, and 2F are cross-sectional side views through the XX′,YY′, and ZZ′ planes, respectively, after performing a RIE process toform the replacement gate 240. A spacer material is then deposited andetched. The spacer material can be any dielectric spacer material.Non-limiting examples of suitable materials for the spacers 220 includedielectric oxides (e.g., silicon oxide), dielectric nitrides (e.g.,silicon nitride), dielectric oxynitrides, or any combination thereof.The spacer material is deposited by a deposition process, for example,chemical vapor deposition (CVD) or physical vapor deposition (PVD). Thespacer 220 material may be etched by a dry etch process, for example, aRIE process.

FIGS. 3A, 3B, and 3C are cross-sectional side views through the XX′,YY′, and ZZ′ planes, respectively, after performing an epitaxial growthprocess to form epitaxial contacts 310 on opposing sides of thereplacement gate 240. The epitaxial contacts 310 form the source anddrain regions. A wet etching process is performed to selectively removethe STI region 120 material surrounding the fins (see FIG. 3B). Then, awet etching process is performed to remove the buffer layer 112 and theheavily doped III-V material layer 113 on opposing sides of thereplacement gate 240. Etching is performed through the substrate 111 toform recesses where the epitaxial contacts 310 are grown. The epitaxialcontacts 310 formed on opposing sides of the replacement gate 240include a III-V material, which can be the same or different than thatof the heavily doped III-V material layer 113 under the dummy gate 240.The III-V materials forming the epitaxial contacts 310 are doped withn-type dopants or p-type dopants as described above for the heavilydoped III-V layer 113. The concentration of the dopant in the III-Vmaterial of the epitaxial contacts is the same or different than theconcentration in the heavily doped III-V material layer 113. In oneaspect, the concentration of the dopant is in a range from about 1e¹⁸ toabout 1e¹⁹ atoms/cm³. In one aspect, the concentration of the dopant isin a range from about 1e¹⁸ to about 1e²⁰ atoms/cm³.

FIGS. 4A, 4B, and 4C are cross-sectional side views through the XX′,YY′, and ZZ′ planes, respectively, after depositing a low-k dielectricoxide layer 410 over the epitaxial contacts 310 and around thereplacement gate 240. The low-k dielectric oxide layer 410 can include,but is not limited to, a spin-on-glass, a flowable oxide, a high densityplasma oxide, borophosphosilicate glass (BPSG), or any combinationthereof. The low-k dielectric oxide layer 410 is deposited by adeposition process, including, but not limited to, molecular beamepitaxy (MBE), CVD, PVD, plasma enhanced CVD, atomic layer deposition(ALD), evaporation, chemical solution deposition, or like processes.

The low-k dielectric oxide layer 410 is planarized, for example, bychemical mechanical planarization (CMP). The thickness of the low-kdielectric oxide layer 410 is not intended to be limited. In one aspect,the thickness of the low-k dielectric oxide layer 410 is in a range fromabout 70 to about 100 nm. In another aspect, the thickness of the low-kdielectric oxide layer 410 is in a range from about 80 to about 90 nm.

A hard mask layer 420 is deposited onto the low-k dielectric oxide layer410 and planarized, by, for example, CMP, down to the level of the dummygate material layer 212. The spacers 220 are also polished away.Non-limiting examples of suitable materials for the hard mask layer 420include SiN, SiOCN, SiBCN, or any combination thereof. The thickness ofthe hard mask layer 420 is not intended to be limited. In one aspect,the thickness of the hard mask layer 420 is in a range from about 20 toabout 30 nm. In another aspect, the thickness of the hard mask layer 420is in a range from about 22 to about 28 nm.

FIGS. 5A, 5B, and 5C are cross-sectional side views through the XX′,YY′, and ZZ′ planes, respectively, after removing the removable gatematerial layer 212 to exposed the heavily doped III-V material layer 113in the channel region. A dry etch process is performed toanisotropically remove the gate material. Then a wet etch process isperformed to remove the removable gate material layer 212 and bufferlayer 210 from between the spacers 220 and expose the channel region 501beneath the gate.

FIGS. 5D, 5E, and 5F are cross-sectional side views through the XX′,YY′, and ZZ′ planes, respectively, after forming a fin recess 502. Thefin recess 502 is formed by performing an etching process through theheavily doped III-V material layer 113 in the channel region and down tothe buffer layer 112. A dry etching process may be employed, e.g., a dryetch with Cl based etch chemistry. The buffer layer 112 functions as anetch stop and prevents etching through to the substrate 111.

FIGS. 6A, 6B, and 6C are cross-sectional side views through the XX′,YY′, and ZZ′ planes, respectively, after performing a replacement fingrowth process. The open gate region and the fins are filled with anundoped III-V material 601, which forms an undoped III-V channel region602. The undoped III-V material 601 can be the same III-V material aseither the highly doped III-V material layer 113 or the epitaxialcontacts 310. The undoped III-V material 601 is grown using a metalorganic chemical vapor deposition (MOCVD) selective growth process. Thebuffer layer 112 and the highly doped III-V material layer 113 under thespacers are lattice matched to the undoped III-V channel region 602.

FIGS. 6D, 6E, and 6F are cross-sectional side views through the XX′,YY′, and ZZ′ planes, respectively, after performing a CMP process toplanarize the undoped III-V material 601.

FIGS. 7A, 7B, and 7C are cross-sectional side views through the XX′,YY′, and ZZ′ planes, respectively, after recessing the fins. A dryetching process is performed to remove the undoped III-V material 601from within the gate structure while leaving the undoped III-V material601 in the channel region beneath the gate. The dry etching process istimed to provide a suitable channel height. Thus, the resulting channelregion 602 includes the undoped III-V material between regions ofheavily doped III-V material layers 113.

The thickness of the undoped III-V material 601 in channel region 602can be tailored and is not intended to be limited. In one aspect, thethickness of the undoped III-V material 601 in the channel region 602 isin a range from about 30 to about 50 nm. In another aspect, thethickness of the undoped III-V material 601 in the channel region 602 isin a range from about 35 to about 45 nm.

FIGS. 7D, 7E, and 7F are cross-sectional side views through the XX′,YY′, and ZZ′ planes, respectively, after removing the surrounding low-kdielectric oxide layer 120 to expose the final fins 701 beneath thegate. The remaining areas of the final fins 701 remain covered in thehard mask layer 420.

FIGS. 8A, 8B, and 8C are cross-sectional side views though the XX′, YY′,and ZZ′ planes, respectively, after filling the gate with a high-kmaterial and a metal gate material to form the final high-k metal gate801. FIG. 8D is a top view of the final gate disposed over the finalfins 701 after removing the hard mask layer 420.

The high-k material can be a dielectric material having a dielectricconstant greater than 4.0, 7.0, or 10.0. Non-limiting examples ofsuitable materials for the high-k dielectric material include oxides,nitrides, oxynitrides, silicates (e.g., metal silicates), aluminates,titanates, nitrides, or any combination thereof. Other non-limitingexamples of suitable high-k dielectric materials include HfO₂, ZrO2,Al₂O₃, TiO₂, La₂O₃, SrTiO₃, LaAlO₃, Y₂O₃, a pervoskite oxide, or anycombination thereof. The high-k dielectric material layer may be formedby known deposition processes, for example, MBE, CVD, PECVD, ALD,evaporation, PVD, chemical solution deposition, or other like processes.The thickness of the high-k dielectric material may vary depending onthe deposition process as well as the composition and number of high-kdielectric materials used. For example, the high-k dielectric materiallayer may have a thickness in a range from about 0.5 to about 20 nm.

A conductive metal is deposited over the high-k dielectric material.Non-limiting examples of suitable conductive metals include Al, Pt, Au,W, Ti, or any combination thereof. The conductive metal may be depositedby a known deposition process, for example, CVD, PECVD, PVD, plating,thermal or e-beam evaporation, and sputtering.

As shown in the final structure in FIG. 8A, the channel region isdefined by three clearly defined and different regions (the undopedIII-V material 601, the heavily doped III-V material layer 113, and theepitaxial contacts 310). The undoped III-V material 601 defines a sharpjunction with the heavily doped III-V material layer 113 beneath thespacers 220. The epitaxial contacts 310, which can include the samematerials and dopants as the heavily doped material layer 113, provide astructure with a sharply defined boundary at heavily doped source drainregions in a semiconductor structure.

The present invention described above provides a semiconductor deviceand methods for forming a sharp channel junction that provides reducedresistance. Specifically, the present invention provides a replacementfin channel approach to form a sharp and heavily doped source and draincontact.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, element components,and/or groups thereof.

The corresponding structures, materials, acts, and equivalents of allmeans or step plus function elements in the claims below are intended toinclude any structure, material, or act for performing the function incombination with other claimed elements as specifically claimed. Thedescription of the present invention has been presented for purposes ofillustration and description, but is not intended to be exhaustive orlimited to the invention in the form disclosed. Many modifications andvariations will be apparent to those of ordinary skill in the artwithout departing from the scope and spirit of the invention. Theembodiment was chosen and described in order to best explain theprinciples of the invention and the practical application, and to enableothers of ordinary skill in the art to understand the invention forvarious embodiments with various modifications as are suited to theparticular use contemplated.

The flow diagrams depicted herein are just one example. There may bemany variations to this diagram or the steps (or operations) describedtherein without departing from the spirit of the invention. Forinstance, the steps may be performed in a differing order or steps maybe added, deleted or modified. All of these variations are considered apart of the claimed invention.

The descriptions of the various embodiments of the present inventionhave been presented for purposes of illustration, but are not intendedto be exhaustive or limited to the embodiments disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the describedembodiments. The terminology used herein was chosen to best explain theprinciples of the embodiments, the practical application or technicalimprovement over technologies found in the marketplace, or to enableothers of ordinary skill in the art to understand the embodimentsdisclosed herein.

What is claimed is:
 1. A method of making a semiconductor device, themethod comprising: depositing a layer of a doped III-V material onto asubstrate, the doped III-V material comprising a dopant in an amount ina range from about 1e¹⁸ to about 1e²⁰ atoms/cm³; patterning a fin in thedoped III-V material and the substrate; forming a gate structure overand substantially perpendicular to the fin; growing by an epitaxialprocess a pair of epitaxial contacts comprising a III-V material overthe fin and on opposing sides of the gate; etching to remove the dopedIII-V material from a portion of a channel region beneath the gatestructure; building up the channel region by filling the gate structureand the channel region with an undoped III-V material; performing atimed etching process to remove the undoped III-V material from the gatestructure and leave the undoped III-V material between remainingportions of the doped III-V material; and filling the gate structurewith a conductive gate metal.
 2. The method of claim 1, wherein formingthe gate structure comprises depositing a removable gate material and ahard mask material over the fin and a reactive ion etch (RIE) process.3. The method of claim 2, further comprising forming spacers alongsidewalls of the gate structure.
 4. The method of claim 2, furthercomprising removing the removable gate material before etching to removethe doped III-V material from a portion of the channel region beneaththe gate structure.
 5. The method of claim 1, wherein the dopant is agroup II, IV, or VI element.